PCB Design – C.B. Distribution
Software solutions

PCB Design

CB Distribution delivers and supports the scalable PCB design solution from Cadence. Cadence PCB design solutions, market under the brands OrCAD and Allegro, are complete design environments for addressing today’s design challenges and manufacturability concerns.

Is your PCB design solution ready to grow with you?

Many solutions on the market position themselves as a one-size-fits-all offering, but is that really what your business needs? Either you are paying too much for capabilities you don’t need or you are constantly fighting your vendor to add functionality to keep up with your pace of innovation. Wouldn’t it be easier if there was a solution designed to scale with you, providing the capabilities and features you need when you need them?

Cadence PCB

CB Distribution delivers and supports the scalable PCB design solution from Cadence. Cadence PCB design solutions, market under the brands OrCAD and Allegro, are complete design environments for addressing today’s design challenges and manufacturability concerns. The design solutions contain everything needed to take a PCB design from concept to production with a fully integrated design flow, including design capture, library tools, design analysis, a layout editor, and an AI driven place and route engine, as well as live interfaces for manufacturing and mechanical CAD.

Scalable solution

A common database architecture, GUI and full part management offer a complete PCB design solution, with the scalability to expand as designs and design challenges increase in complexity. The solution result in increased productivity, shorter design cycles, and faster ramp up to volume production.

System analysis

Today’s engineers need to address electromagnetic, electronics, thermal, and electromechanical simulation challenges to ensure their system works under wide-ranging operating conditions. 

Cadence’s high-capacity and high-accuracy multi-physics analysis technologies enable designers to perform analysis with an in-design process methodology that goes from chip up to the entire system. With the Cadence analysis technologies designers can consider issues of electromagnetic interference (EMI) / electromagnetic compatibility (EMC), as well as power integrity (PI), signal integrity (SI), and thermal integrity.

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